Semiconductor Alumina Ceramic Plate Double Surface Grinding Lapping Solution

Machine Model:  YH2M84100 Double Disk Grinding Lapping Machine

Workpiece:  Semiconductor Alumina Ceramic Plate-59*59* T 26.45mm

Requirement:  Flatness 0.003mm, Parallelism 0.007mm,Roughness Ra0.8μm；

Results:  Flatness≤0.001mm， Parallelism≤0.002mm，Ra0.8μm；

• Main applications of semiconductor alumina ceramics:

    1. Electronic packaging substrate: used for IC packaging and power modules, with high insulation and good thermal conductivity. 

    2. Chip holder: provides mechanical support, insulation and thermal stability. 

    3. Radiator material: used for high-power devices to improve heat dissipation performance. 

   4. Vacuum devices and sensors: used in high heat resistance and corrosion resistance environments.

• Semiconductor alumina ceramic sheet surface grinding and polishing process requirements:

1.  Grinding: Diamond grinding wheel is required to ensure high-precision processing of high-hardness materials and control flatness and roughness.

2.  Polishing: Multi-step fine processing to ensure surface finish and adapt to high-precision semiconductor applications.

3. Dimension control: Strictly control tolerances to avoid thermal deformation and dimensional deviation to ensure product consistency.