Hunan Yuhuan Jingyan Technology Co., Ltd is a wholly-owned subsidiary of Yuhuan CNC Machine Tool Co., LTD. (stock abbreviation: Yuhuan CNC, stock code: 002903), established in 2023.

The company has developed a comprehensive R&D system and process characteristics in the area of accurate and effective grinding and polishing after years of accumulation. It has focused its technical and human resources on professionally developing equipment related to semiconductor processing, further broadening the market for its products, based on its current technological advantages and in response to the processing demands of grinding and polishing equipment in the semiconductor industry. Establish new business expansion opportunities for the organization's long-term strategic growth.

Surface grinding, rounding processing, single-sided/double-sided grinding, and polishing of different material crystals are the primary techniques used in the company's products. Vertical high-precision double-sided grinding and polishing machines, vertical shaft cylindrical grinding machines, multipurpose cylindrical grinding machines, vertical single-sided grinding and polishing machines, etc. are among the primary products. In industries including semiconductors, the military, aircraft, 3C consumer electronics, the automotive sector, new energy, and new materials, they are extensively utilized in the precise processing of components.

With the enterprise purpose and mission of "achieving cutting-edge manufacturing and revitalizing national industry," the company has always upheld the enterprise spirit of "responsibility as the foundation, innovation as the strategy, development as the constant, and dedication as the honor." It is dedicated to being a leader in semiconductor processing equipment and other industrial industries, and it is driven to develop and push forward.

Exhibited products

The company primarily manufactures precision processing equipment for the semiconductor industry. Crystal materials include sapphire, monocrystalline silicon, silicon carbide, gallium arsenide, indium phosphide, cadmium zinc telluride, gallium nitride, gallium oxide, gallium antimonide, indium antimonide, and so on. Surface grinding, rounding processing, single- and double-sided grinding and polishing, single-station thinning, and so on are among the procedures involved.

YHM7425 vertical single-sided grinding machine

1. It is suitable for planar processing of silicon carbide crystals.

2. The Z-axis feed adopts a closed-loop control driven by "servo motor + lead screw guide rail + linear grating" to achieve high-precision continuous micro-feed.

3. The main shaft adopts an electric spindle structure, featuring a higher grinding torque, smooth operation, low vibration and low noise.

4. The worktable adopts turntable bearings, ensuring high precision in grinding parts.

5. Automatic grinding wheel dressing mechanism, no need to stop the machine.

YHMGK1720 Precision CNC multi-functional cylindrical Grinding Machine

1.The machine tool can perform cylindrical grinding, crystal orientation detection, reference edge (OF) surface grinding and V-NOTCH groove grinding on hard and brittle crystal ingots such as silicon carbide and sapphire.

2. Customized grinding spindles with a rotational speed of up to 12,000 RPM.

3. The headstock adopts a direct drive motor + circular grating structure, forming a full closed-loop control. The Angle positioning of the workpiece is more accurate, and the crystal orientation accuracy is easier to guarantee.

4. The crystal orientation detection component is built into the headstock. After grinding the outer circle, it automatically detects the crystal orientation Angle to reduce multiple clamping errors.

YH2MG8436 Vertical high-precision double-sided grinding and polishing machine

1.This machine is mainly used for high-precision double-sided grinding and polishing of thin sheet parts made of materials such as silicon carbide, sapphire, gallium nitride, silicon nitride, alumina, and aluminum nitride ceramics.

2. Four motors are independently driven and feature stepless speed regulation, demonstrating excellent process adaptability.

3. The upper plate adopts an airbag pressure loading mode, ensuring precise pressure loading.

4. The upper plate adopts a universal self-adaptive structure to ensure the processing accuracy of the workpiece.

5. An automatic online measurement system is configured to precisely control the thickness and size of the workpiece during grinding.

YH2MG81 Series - Single-sided Grinding and Polishing Machine

1.It is suitable for high-precision single-sided grinding and polishing of multi-chip or large-chip wafers made of semiconductor materials, optical materials, sapphire materials, ceramic materials, silicon, germanium and other materials.

2. The lower disc is supported by large-sized high-precision turntable bearings, featuring high rotational accuracy and good stability.

3.The temperature of the lower plate surface is closed-loop controlled, ensuring high product accuracy.

4. Main reducer of German SEW brand.

5. High pressure control accuracy.

6. The maximum loading pressure of a single workpiece shaft reaches 500Kg, ensuring high processing efficiency.

YHMG7430 high-precision vertical single-sided grinding machine

1.It is mainly used for the precise thinning of hard and brittle materials such as sapphire, silicon wafers, germanium wafers, silicon carbide, gallium nitride, gallium arsenide, silicon nitride and ceramics.

2. The grinding wheel adopts a 12-inch standard diamond special grinding wheel. The thinning unit adopts the axial Feed grinding principle and is compatible with the thinning processing of wafers with diameters ranging from Φ300 to 100mm.

3. The grinding wheel spindle adopts a high-precision air flotation dedicated spindle, and the drive mode is synchronous motor drive. Different process speeds can be adjusted according to different products.