EN 
VI
TH
KO
RU
ID
TR
Semiconductor Equipment High precision Double Sided Lapping Polishing Machine YH2MG8436 for Quartz Glass Sapphire
This lapping machine is mainly used for high-precision double-sided grinding and polishing of thin slice parts made of silicon carbide, sapphire, gallium nitride, zirconium oxide, silicon nitride, beryllium nitride, aluminum oxide, aluminum nitride ceramics and other materials, and can realize the end surface of the part high-precision processing requirements.
Technical characters
Main Features:
This machine is suitable for precision grinding and polishing of semiconductor materials with high hardness and high processing accuracy requirements. It is especially suitable for processing thin parts. The polishing pressure is uniform and it is not easy to fragment.
The interior of the machine tool uses DuPont Teflon anti-corrosion treatment to ensure the service life of the parts.
The lower plate is supported by an advanced oil floating hydrostatic platform to ensure the support stiffness and rotation accuracy of the lower plate.
The upper plate is pulled by a steel wire balance system, which can automatically adjust the level of the upper plate.
The outer ring gear is raised and lowered by oil pressure, while the lower plate remains fixed, allowing the lower plate to achieve higher precision and stability.
The machine tool is equipped with an automatic online measuring device, which can achieve precise control of the grinding thickness and size of the workpiece.
Performance
Main Parameters
| No | Item Name | Parameters |
| 1 | Size of Upper/Lower Plate （OD*ID*H） | Φ1127xΦ397x50mm |
| 2 | Feeding Plate's QTY | 5 Pcs |
| 3 | Max Size of Lapping Workpiece | 335mm(Diameter or Diagonal） |
| 4 | Thickness Range of Lapping Workpiece | 0.2~25mm |
| 5 | Max Processing Pressure | 700kg |
| 6 | Ring Gear Lift Height | 26mm |
| 7 | Max Rotation Speed ofUpper/Lower Plate | 30R/Min,60R/Min |
| 8 | Max Rotation Speed of Sungear | 25R/Min |
| 9 | Max Rotation Speed of Ring Gear | 25R/Min |
| 10 | Motor Power ofUpper/Lower Plate | 7.5KW/7.5KW |
| 11 | Motor Power of the whole Machine | 22KW |
| 12 | Size of The Machine | About 2000×1600×3080mm |
| 13 | The Weight of the Machine | About 6000kg |
Certificate
Our R & D team establish a long - term partnership with National University of Defense Technology , Dalian University of Technology , Hunan University , Central South University , and other renowned institutions . Yuhuan is also research base for Hunan University’s doctoral student,get 5—9 patents per year .
- has got36 related patents
- A certificate of international standard products in 2005
- has passedISO9001 : 2000 international quality system certification, has estabished corporate product standards
Packing and Transportation
1.Moisture-proof packaging+Wooden Box.
2.Special packing requirements available.
Other categories
- grinding machine for seal
- cnc grinder cnc metalworking & manufacturing
- surface grinding machine in hindi
- surface granding machine
- double sided grinding machine
- single head polishing machine price
- surface grinder from china
- surface grinding machine in india
- grinding machine for cylinder piston ring
- double surface grinding machine for ceramics
- 5 axis cnc tool grinding machine
- metal grinding machines
- High precision surface grinder machine
- precision cnc grinding
- CNC double disc grinding machine
- Sprocket grinding machine
- Types of double surface grinding
- Twin head polishing machine
- Precision double square polishing machine
- Double disk grinding machine
- Precision grinding machine for ceramics
- Metal double surface grinder machine
- CNC lapping polishing machine
- Brake rotor grinding machine
- 5-axis CNC Tool double surface Grinding Machine
- Bearing double disc grinder
- Brake disc double disc grinder
- Vertical surface grinder
- vertical lapping machine
- Surface lapping polishing machine
