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Double Surface Lapping Polishing Machine

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sapphire
Semiconductor Equipment High precision Double Sided Lapping Polishing Machine YH2MG8436 for Quartz Glass Sapphire
Semiconductor Equipment High precision Double Sided Lapping Polishing Machine YH2MG8436 for Quartz Glass Sapphire
Semiconductor Equipment High precision Double Sided Lapping Polishing Machine YH2MG8436 for Quartz Glass Sapphire
Semiconductor Equipment High precision Double Sided Lapping Polishing Machine YH2MG8436 for Quartz Glass Sapphire
Semiconductor Equipment High precision Double Sided Lapping Polishing Machine YH2MG8436 for Quartz Glass Sapphire
Semiconductor Equipment High precision Double Sided Lapping Polishing Machine YH2MG8436 for Quartz Glass Sapphire
Semiconductor Equipment High precision Double Sided Lapping Polishing Machine YH2MG8436 for Quartz Glass Sapphire
Semiconductor Equipment High precision Double Sided Lapping Polishing Machine YH2MG8436 for Quartz Glass Sapphire
Semiconductor Equipment High precision Double Sided Lapping Polishing Machine YH2MG8436 for Quartz Glass Sapphire

Semiconductor Equipment High precision Double Sided Lapping Polishing Machine YH2MG8436 for Quartz Glass Sapphire


This lapping machine is mainly used for high-precision double-sided grinding and polishing of thin slice parts made of silicon carbide, sapphire, gallium nitride, zirconium oxide, silicon nitride, beryllium nitride, aluminum oxide, aluminum nitride ceramics and other materials, and can realize the end surface of the part high-precision processing requirements.

precision lapping machine application

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Technical characters

Main Features:

  1. This machine is suitable for precision grinding and polishing of semiconductor materials with high hardness and high processing accuracy requirements. It is especially suitable for processing thin parts. The polishing pressure is uniform and it is not easy to fragment.

  2. The interior of the machine tool uses DuPont Teflon anti-corrosion treatment to ensure the service life of the parts.

  3. The lower plate is supported by an advanced oil floating hydrostatic platform to ensure the support stiffness and rotation accuracy of the lower plate.

  4. The upper plate is pulled by a steel wire balance system, which can automatically adjust the level of the upper plate.

  5. The outer ring gear is raised and lowered by oil pressure, while the lower plate remains fixed, allowing the lower plate to achieve higher precision and stability.

  6. The machine tool is equipped with an automatic online measuring device, which can achieve precise control of the grinding thickness and size of the workpiece.

Performance

Main Parameters

No
Item Name
Parameters
1
Size of Upper/Lower Plate

(OD*ID*H

Φ1127xΦ397x50mm
2Feeding Plate's QTY
5 Pcs
3Max Size of Lapping Workpiece
335mm(Diameter or Diagonal)
4Thickness Range of Lapping Workpiece
0.2~25mm
5Max Processing Pressure700kg
6Ring Gear Lift Height26mm
7Max Rotation Speed ofUpper/Lower Plate
30R/Min,60R/Min
8Max Rotation Speed of Sungear25R/Min
9Max Rotation Speed of Ring Gear
25R/Min
10Motor Power ofUpper/Lower Plate
7.5KW/7.5KW
11Motor Power of the whole Machine
22KW
12Size of The Machine
About 2000×1600×3080mm
13The Weight of the Machine
About 6000kg


Certificate

certification

Our R & D team  establish a long - term partnership with National University of Defense Technology , Dalian University of Technology , Hunan University , Central South University , and other renowned institutions . Yuhuan is also research base for Hunan University’s doctoral student,get 5—9 patents per year .

  • has got36 related patents
  • A certificate of international standard products in 2005
  • has passedISO9001 : 2000 international quality system certification, has estabished corporate product standards
Packing and Transportation

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1.Moisture-proof packaging+Wooden Box.
2.Special packing requirements available.

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