YH2M8436B Precision Vertical Double Surface Lapping/Polishing Machine
This equipment is mainly used for lapping and polishing both sides of the parallel surface of thin metal and hard brittle nonmetal parts, such as silicon, sapphire crystal, ceramic, optical glass, quartz crystal and other semiconductor materials.
Technical characters
Technical characteristics:
● The machine is according to four planetary gears motion principle.
● This machine adopts the way of the inner gear ring lifting. The cylinder pushes spiral cam to drive the ring gear lift when it ups and downs. It is controlled by a three manual valve device which is installed in the right side. The gear ring can be adjusted.
● Double motor driving. The main motor drives the upper lapping plate, the lower lapping plate and the inner gear ring to rotate by a series of variable speed, And the sunwheel is driven by the auxiliary motor. Both the main motor and the auxiliary motor are frequency conversion. The lower lapping plate, inner ring gear and the sun wheel rotate in the same direction, but the upper lapping plate opposite.
● The machine is equipped with safety lock cylinder, when the upper lapping rises to the up limitation, the inserting plate comes out to prevent it falling down so that ensure the operator and equipment safety.
● PLC control is flexible and reliable.
● It adopts touch screen as man-machine interface device, which displays the alarm and in real time information of machine status, it is very friendly and with large amount of information.
Application
The device can be processed workpiece including valve plate, valve plate, friction plate, rigid seal ring, cylinder piston ring, oil pump blades, silicon, germanium, quartz crystal, glass, ceramics, sapphire, gallium arsenide, lithium niobite etc.
Performance
Specification
Item | YH2M8436B |
Lapping plate size(OD* ID*THK) | φ1140xφ375x45mm |
Planetary wheel spec | P=15.875 Z=84 |
n Planetary Wheel Qty | 3≤n≤5 |
The max workpiece size | (Rectangle diagonal 360mm) |
The min THK | 0.4mm |
Lapping workpiece flatness | ≤0.008mm(φ200) |
Polishing workpiece flatness | ≤0.005mm(φ200) |
Lapping workpiece roughness | ≤Ra0.15μm |
Polishing workpiece roughness | ≤Ra0.125μm |
Size(L*W*H) | 1800x1500x2650mm |
Weight | 3000kg |
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