SiC - Silicon Carbide Wafer Precision CNC Multifunctional Cylindrical Grinding Machine Start Testing
YUHUAN Start Testing a New Model YHMGK1720 Precision CNC Multifunctional Cylindrical Grinding Machine.
This Precision CNC Multifunctional Cylindrical Grinding Machine YHMCK1720 Can Grinding the
SIC or Sapphire Wafer ,which the Diameter of it can support φ100~φ210mm,The Width Range
will be about 10~500mm.Cylindrical precision can be 0.01mm.