Silicon Carbide Plate Double Surface Grinding Machine Solution

Machine Model: YHDM580B Double Disk Grinder- Cycle Grinding Method

Workpiece: Silicon Carbide Plate(SiC)

Requirement: 7.150±0.002mm，Flatness/Parallelism＜0.01mm，Roughness Ra＜0.9

Silicon Carbide (SiC) is an inorganic material having mechanical, thermal, electrical and chemical properties, due to which it is widely used in developed industries. However, the beneficial properties of SiC ceramic such as high hardness, high strength, wear resistance, extreme brittleness and chemical stability make SiC machining difficult and costly through conventional and non-conventional machining methods. The diamond grinding wheel produces high MRR doesn’t affecting surface morphology and finishing. During grinding performance ofSiC the material prop- erties of wheel and workpiece are important factor for predicting the surface roughness. In computerized numerical control grinding machine by utilizing metal bond diamond tools created the low induced damage. The micro-structural heterogeneity signifi- cantly increases the drilling and grinding rates of SiC. The increase in dynamic fracture toughness resulted into high MRR of SiC having better surface finish was achieved in high speed grinding process.In grinding methods by applying bonded abrasive wheels the low surface roughness and high shape accuracy achieved on mirrors of SiC. The combination of high workpiece speed and velocity of elevated grinding wheel can reduced the phase transformation observed during high speed cylindrical grinding process.