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Semiconductor Lapping machine High precision Double Sided Lapping Grinding Machine YH2MG8436 for Ceramic

Semiconductor Lapping machine High precision Double Sided Lapping Grinding Machine YH2MG8436 for Ceramic

This lapping machine is mainly used for high-precision double surface grinding and polishing of thin slice parts made of silicon carbide, sapphire, gallium nitride, zirconium oxide, silicon nitride, beryllium nitride, aluminum oxide, aluminum nitride ceramics and other materials, and can realize the end surface of the part high-precision processing requirements.

precision lapping machine application

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Technical characters

Main Features:

This machine is suitable for precision grinding and polishing of semiconductor materials with high hardness and high processing accuracy requirements. It is especially suitable for processing thin parts. The polishing pressure is uniform and it is not easy to fragment.
The interior of the machine tool uses DuPont Teflon anti-corrosion treatment to ensure the service life of the parts.
The lower plate is supported by an advanced oil floating hydrostatic platform to ensure the support stiffness and rotation accuracy of the lower plate.
The upper plate is pulled by a steel wire balance system, which can automatically adjust the level of the upper plate.
The outer ring gear is raised and lowered by oil pressure, while the lower plate remains fixed, allowing the lower plate to achieve higher precision and stability.
The machine tool is equipped with an automatic online measuring device, which can achieve precise control of the grinding thickness and size of the workpiece.

Performance

Main Parameters

No	Item Name	Parameters
1	Size of Upper/Lower Plate （ODIDH）	Φ1127xΦ397x50mm
2	Feeding Plate's QTY	5 Pcs
3	Max Size of Lapping Workpiece	335mm(Diameter or Diagonal）
4	Thickness Range of Lapping Workpiece	0.2~25mm
5	Max Processing Pressure	700kg
6	Ring Gear Lift Height	26mm
7	Max Rotation Speed ofUpper/Lower Plate	30R/Min,60R/Min
8	Max Rotation Speed of Sungear	25R/Min
9	Max Rotation Speed of Ring Gear	25R/Min
10	Motor Power ofUpper/Lower Plate	7.5KW/7.5KW
11	Motor Power of the whole Machine	22KW
12	Size of The Machine	About 2000×1600×3080mm
13	The Weight of the Machine	About 6000kg

Certificate

certification

Our R & D team establish a long - term partnership with National University of Defense Technology , Dalian University of Technology , Hunan University , Central South University , and other renowned institutions . Yuhuan is also research base for Hunan University’s doctoral student,get 5—9 patents per year .

has got36 related patents
A certificate of international standard products in 2005
has passedISO9001 : 2000 international quality system certification, has estabished corporate product standards