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Semiconductor Grinding Lapping Machine

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Semiconductor Single Disc Grinding Machine for silicon carbide and sapphire YHM7445
Semiconductor Single Disc Grinding Machine for silicon carbide and sapphire YHM7445
Semiconductor Single Disc Grinding Machine for silicon carbide and sapphire YHM7445
Semiconductor Single Disc Grinding Machine for silicon carbide and sapphire YHM7445

Semiconductor Single Disc Grinding Machine for silicon carbide and sapphire YHM7445


YHM7445 This machine tool is suitable for flat surface processing of 4/6/8-inch silicon carbide, sapphire, and gallium nitride. It can achieve high-precision and high-surface finish processing of the surface of parts.

陶瓷基片蓝宝石衬底碳化硅

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Technical characters


Main Features:

1.The bed adopts an integrated welded part, and the column is cast with advanced cast iron, featuring high precision stability, strong shock absorption capability, and the arrangement of reasonable reinforcing ribs enhances the structure's strength. Welded parts and castings are both subjected to secondary annealing and shot blasting treatments to make the base components more stable and reliable.

2. The rotation of the worktable is supported by high-precision special rotary table bearings,driven by a servo motor and reducer to ensure rotational accuracy and smoothness.

3. The grinding head and the angle of the worktable can be adjusted, and it is convenient to check the angle, which can adapt to different continuous feed grinding methods.

4. Equipped with a strong magnetic suction worktable, and the magnetic attraction is controlled by a program.

5. The Z-axis uses a precision ball screw, paired with a stable and reliable servo system, to maintain high precision and high stability in the up and down tool movement.

Performance

Main Parameterers

Item Name

Parameter

Item Name

Parameter

Grinding Wheel Diameter

φ450*40*φ360mm

X Axis Stroke

170mm

Grinding Workpiece

Max Diameter

φ200mm 8inch

X Axis Motor Power

0.85Kw

Grinding Workpiece

Max Thickness

100mm

Working Station Motor Power

1.8Kw

Grinding Head

Motor Speed

50~2500rpm  

Stepless Speed 

Regulation

Working Station Motor Speed

5~75rpm

Grinding Head Motor

 Power

15Kw

Control System

PLC

Grinding Head Stroke

250mm

Machine Total Power

25Kw

Grinding Head Min Feed

0.001mm

Machine Size

2600x1800x2950mm

Z-axis Feed Servo

Motor Power

0.85Kw

Machine Total Weight

About 3500Kg

Certificate

certification

Our R & D team  establish a long - term partnership with National University of Defense Technology , Dalian University of Technology , Hunan University , Central South University , and other renowned institutions . Yuhuan is also research base for Hunan University’s doctoral student,get 5—9 patents per year .

  • has got36 related patents
  • A certificate of international standard products in 2005
  • has passedISO9001 : 2000 international quality system certification, has estabished corporate product standards
Packing and Transportation

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1.Moisture-proof packaging+Wooden Box.
2.Special packing requirements available.

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