Vertical High-Precision Surface Grinding Polishing Machine for sapphire SiC Glass Semiconductor
This high-end precision lapping polishing machine is designed specifically for semiconductor products. It is suitable for single-sided high-precision grinding and polishing of sapphire, silicon carbide (SiC), ceramics and other materials to meet your ultimate pursuit of high-quality surfaces.

Technical characters
Features:
1. The machine tool is designed with good rigidity and high precision. Finite element analysis is used in the design of key components. All guide rails and bearings are precision-level. The maximum speed of the polishing disc is 60r/min, and the maximum speed of the workpiece disc is 60r/min, with high polishing efficiency;
2. The four workpiece axies can individually control the polishing pressure, polishing time, and speed, and can perform differentiated processing;
3. The equipment reserves automatic loading and unloading positions for easy installation of automation;
4. The overall protection device is adopted, the equipment is more environmentally friendly and safe, and a safety light curtain is installed on the manual operation side;
5. PLC control is adopted, the recipe data storage capacity is large, and 100 recipes can be stored. A single recipe can be processed in 10 sections;
6. With touch screen display and operation, the human-machine interface is friendly, and each key sensor uses parameterized display for easy operation and control.
Performance
No | Item | Parameters |
1 | Diameter of Lapping Disc | φ1422mm |
2 | Diameter of workpiece Disc | Ф550mm |
3 | Rotation Speed of Lapping Disc | 5~60r/min |
4 | Workpiece spindle speed | 5~60r/min |
5 | Max polishing pressure of singleSpindle | 500Kg |
6 | Flatness of Lapping Disc | 0.01mm |
7 | End face runoutof Lapping Disc | 0.01mm |
8 | Flatness of Workpiece Disc | 0.005mm |
9 | Overall dimensions(LxWxH) | About 2150×2050×3020mm |
10 | MachineWeight | About 8800Kg |
11 | Total Power | ≤30KW |
Certificate

Our R & D team establish a long - term partnership with National University of Defense Technology , Dalian University of Technology , Hunan University , Central South University , and other renowned institutions . Yuhuan is also research base for Hunan University’s doctoral student,get 5—9 patents per year .has got36 related patentsA certificate of international standard products in 2005has passedISO9001 : 2000 international quality system certification, has estabished corporate product standards
Packing and Transportation

1.Moisture-proof packaging+Wooden Box.
2.Special packing requirements available.
Other categories
- Types of Grinding Machines & Uses
- industrial grinding machine price
- surface granding machine
- Double surface grinding machines for bearing
- Cylindrical Grinder grinding machine
- MOTORCYCLE BRAKE DISC GRINDING MACHINE
- grinding cnc surface polishing machine
- double ended grinding machine
- high precision double disc grinding machine
- Double-wheel surface grinder
- Metal double Surface CNC Grinding Machine
- 5 axis cnc double surface grinding machine
- Grinding Machine for Metal Housing
- multifunctional grinding machine
- Double surface grinding machines
- surface grinding machine types
- surface grinding machining
- metal double disc grinder machine
- brake disc double surface grinder
- Vertical double surface grinder machine
- Precision surface grinder
- 5-axis CNC Tool double surface Grinding Machine
- watch cover polishing lapping machine
- vertical spindle surface grinding machine
- Choose Best Surface Grinder
- Double Surface Grinder for Automotive Components
- Surface Grinding Machine International
- CNC Grinding Machine Market Trends
- Surface Grinding Machine After-Sales Service
- High Precision Lapping Polishing Machine

EN
VI
TH
KO
ID
TR
JA


