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Semiconductor Grinding Lapping Machine

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Vertical High-Precision Surface Grinding Polishing Machine for sapphire SiC Glass Semiconductor
Vertical High-Precision Surface Grinding Polishing Machine for sapphire SiC Glass Semiconductor
Vertical High-Precision Surface Grinding Polishing Machine for sapphire SiC Glass Semiconductor

Vertical High-Precision Surface Grinding Polishing Machine for sapphire SiC Glass Semiconductor


This high-end precision lapping polishing machine is designed specifically for semiconductor products. It is suitable for single-sided high-precision grinding and polishing of sapphire, silicon carbide (SiC), ceramics and other materials to meet your ultimate pursuit of high-quality surfaces.

semiconductor products

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Technical characters

Features:

1. The machine tool is designed with good rigidity and high precision. Finite element analysis is used in the design of key components. All guide rails and bearings are precision-level. The maximum speed of the polishing disc is 60r/min, and the maximum speed of the workpiece disc is 60r/min, with high polishing efficiency;

2. The four workpiece axies can individually control the polishing pressure, polishing time, and speed, and can perform differentiated processing;

3. The equipment reserves automatic loading and unloading positions for easy installation of automation;

4. The overall protection device is adopted, the equipment is more environmentally friendly and safe, and a safety light curtain is installed on the manual operation side;

5. PLC control is adopted, the recipe data storage capacity is large, and 100 recipes can be stored. A single recipe can be processed in 10 sections;

6. With touch screen display and operation, the human-machine interface is friendly, and each key sensor uses parameterized display for easy operation and control.

Performance

No

Item

Parameters

1

Diameter of Lapping Disc

φ1422mm

2

Diameter of workpiece Disc

Ф550mm

3

Rotation Speed of Lapping Disc

5~60r/min

4

Workpiece spindle speed

5~60r/min

5

Max polishing pressure of singleSpindle

500Kg

6

Flatness of Lapping Disc

0.01mm

7

End face runoutof Lapping Disc

0.01mm

8

Flatness of Workpiece Disc

0.005mm

9

Overall dimensionsLxWxH

About 2150×2050×3020mm

10

MachineWeight

About 8800Kg

11

Total Power

30KW

Certificate

certification

Our R & D team establish a long - term partnership with National University of Defense Technology , Dalian University of Technology , Hunan University , Central South University , and other renowned institutions . Yuhuan is also research base for Hunan University’s doctoral student,get 5—9 patents per year .has got36 related patentsA certificate of international standard products in 2005has passedISO9001 : 2000 international quality system certification, has estabished corporate product standards

Packing and Transportation

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1.Moisture-proof packaging+Wooden Box.
2.Special packing requirements available.

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