1. The grinding wheel adopts the 12-inch national standard diamond grinding wheel. The selection of the grinding wheel particle size is customized according to the customers process requirements; the thinning unit adopts the axial feed(In-Feed) grinding principle, which is compatible with 300~50mm wafer grinding and thinning processing.

2. The Machine has functions such as multi-stage grinding program and overload waiting to meet various process requirements.

3. The grinding wheel spindle adopts a high-precision air-floating special electric
spindle, which is controlled by the CNC system through the frequency converter for speed regulation, and the process speed can be determined according to different products.

4. In order to achieve high-precision and high-quality processing, it is equipped with a high-rigidity, low-vibration, and low-thermal expansion air-floating spindle. The spindle of the work bench is also equipped with high-rigidity, low-vibration, and low-thermal expansion air bearing components.

5. High-precision screw and guide rail components are used, and the driving method is driven by a servo full closed-bop control system.

Our R & D team  establish a long - term partnership with National University of Defense Technology , Dalian University of Technology , Hunan University , Central South University , and other renowned institutions . Yuhuan is also research base for Hunan University’s doctoral student,get 5—9 patents per year .

Has got36 related patents

A certificate of international standard products in 2005

Has passedISO9001 : 2000 international quality system certification,  has estabished corporate product standards

1. Moisture-proof packaging+Wooden Box.

2. Special packing requirements available.