YH2M8432 Màquina lapidadora de doble superfície
This machine can be used for lapping/polishing double-surface of thin components such as glass/ceramics/sapphire/carbon arsenide/ferrite/ lithium niobite .
● This machine’s each axis of tray, lower plate ,upper plate bears weight by TRB(tapered roller bearing) and DGRB(deep groove ball bearing),machine precision can be assured;
● Gear ring up and down can be realized through cam bushing driven by air cylinder;
● Sun wheel is driven by 1.5KW motor with reduction gears;
● Lower polishing plate, and inner gear rings are directly driven by reduction gears, stepless variable frequency for speed-regulating, stable start &stop without impact.
● Upper polishing plate is directly driven by one reduction gears, stepless variable frequency for speed-regulating, stable start &stop without impact, the ideal polishing speed can be achieved for different material polishing.
● All control parts adopt 24v power supply, which can assure safety of the operator and equipment.
The device can be processed workpiece including valve plate, friction plate, rigid seal ring, cylinder piston ring, oil pump blades, silicon, germanium, quartz crystal, glass, ceramics, sapphire, gallium arsenide, lithium niobite etc.
Upper plate size(OD*ID*Thickness)
Lower plate size(OD*ID*Thickness)
Max machining pressure
300kgf (Polishing pad and brush polishing)
Work piece min thickness
0.4mm(Straight-sided work piece)
Work piece max size
(Rectangle, diagonal line:290mm)
Machined work piece precision
Output Parallelism can be assured to reach 0.005 when input parallelism is within 0.005
Upper grinding disc speed
Upper plate speed:5-50rpm (stepless regulating)
Lower grinding disc speed
Lower plate speed:5-45rpm (stepless regulating)
Dimensions totals (L×W×H)
1600 1440 × × 2700mm
Dimensió general (L * W * H)
1600 1625 × × 2150mm